新型LED蓝宝石衬底抛光液设计及其抛光机理研究

项目名称： 新型LED蓝宝石衬底抛光液设计及其抛光机理研究

项目编号： No.51205387

项目类型： 青年科学基金项目

立项/批准年度： 2013

项目学科： 机械工程学科

项目作者： 张泽芳

作者单位： 中国科学院上海微系统与信息技术研究所

项目金额： 24万元

中文摘要： 针对LED蓝宝石衬底原子级粗糙度和无损伤的加工要求，以及现有化学机械抛光（CMP）液效率低下的问题，本项目基于现有CMP机理将从磨料（机械）和化学配方（化学）两个方面分别提出解决方案，设计新型抛光液。在机械方面，采用粒径混合的氧化硅胶体磨料和"软团聚"的氧化硅胶体磨料，以提高抛光速率；在化学方面，采用具有双官能团的X-R-Y添加剂，以期在不降低速率的前提下提高表面质量。通过研究粒径混合磨料、软团聚磨料和双官能团添加剂的特性及其抛光机制，以及研究它们与蓝宝石衬底、抛光垫、抛光工艺参数之间相互作用的关系规律，探索实现LED蓝宝石衬底CMP高速率和超光滑表面的方法与途径，阐明蓝宝石衬底CMP过程中的摩擦和化学机理,为新型LED蓝宝石衬底抛光液设计提供思路。

中文关键词： 蓝宝石；化学机械抛光；抛光液；磨料；化学配方

英文摘要： In order to improve the surface quality of LED sapphire substrate and increase the polishing rates during the chemical mechanical polishing (CMP) process, the novel slurry will be designed from two aspects: one is abrasive (Mechanical), and another is chemical formulation (Chemical) based on the existing CMP mechanism.Colloidal silica abrasives with mixed particle size and "soft agglomeration" will be studied to increase the polishing rates in mechanical effect, and the special additive of X-R-Y with double functional group will be adopted to improve the surface quality without deterioration of polishing rates in chemical effect. Through the study of the characteristic and polishing mechanism of mixed particle size abrasive, soft agglomerated abrasive and double functional additive, and the investigation of the relationship among abrasive, chemicals, sapphire, polishing pad and process parameters, the CMP of LED sapphire substrate with high polishing rates and ultra-smooth surface will be realized and the friction and chemical mechanism during LED sapphire CMP will be illustrated. This project will offer the idea to design novel LED sapphire slurry.

英文关键词： Sapphire；Chemical mechanical polishing；Slurry；Abrasive；Chemical formulation