MMC专刊征稿，1月15日截止，审稿时长仅1月！附赠MMC学术报告锦集

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MMC专刊征稿，1月15日截止，审稿时长仅1月！附赠MMC学术报告锦集

2019 年 11 月 28 日 NE电气

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Call for Papers

CPSS Transactions on Power Electronics and Applications (CPSS TPEA)

Special Issue on Modular Multilevel Converters, 2020

Guest Editor-in-Chief

Jin Wang

The Ohio State University, United States

Guest Co-Editor-in-Chief

Yi Tang

Nanyang Technology University, Singapore

Guest Associate Editors

Axel Mertens

Leibniz University Hannover, Germany

Herbert Ginn

University of South Carolina, USA

Julia Zhang

The Ohio State University, USA

Sixing Du

Xi’an Jaotong University, China

Zheyu Zhang

Clemson University, USA

Biela Jürgen

ETH Zurich, Switzerland

Jianjun Sun

Wuhan University, China

Ke Ma

Shanghai Jiao Tong University, China

Xiu Yao

University at Buffalo, USA

Deadline for Submission of Manuscripts: January 15, 2020

The modular multilevel converter (MMC), since its inception, is poised to change the landscape of medium and high voltage power electronics applications. In general, power electronics circuit topologies are centered around capacitors, inductors, or combinations of capacitors and inductors, which can be seen as a hybrid approach. Conventional multilevel converters are capacitor centered and have their advantages and limitations. For example, the NPC multilevel converters and flying capacitor multilevel converters can be back-back connected but are not easily scalable to achieve higher voltage. The cascade multilevel converter has a modular structure but cannot be back-to-back connected. Compared to the aforementioned multilevel converters, MMC indeed is a remarkable hybrid circuit that has both capacitors based submodules and arm inductors and achieves modularity, feasibility for back-back connection, and good scalability, at the same time. Though MMC has been implemented in many applications already, with the introduction of wide bandgap power devices and the needs to further improve power density, efficiency, and reliability, many challenges still remain.

This special issue serves to foster and collect new research achievements on MMC. Prospective authors are invited to submit original contributions or survey papers for peer review for publication in CPSS TPEA. Topics of interest of this Special Issue include, but are not limited to:

Circuit topology variations
Control of MMCs
Sub-module voltage balancing
Circulating current control
Methods for capacitor size reduction
Integration of wide bandgap power devices
dv/dt control of wide bandgap power device based MMCs
Integration of renewable energy and energy storage
MMC based motor drives
MMC in HVDC and MVDC
MMC in smart power stations

The manuscripts should be submitted through Manuscript Central at https://cn03.manuscriptcentral.com/tpea-cpss. Submissions must be clearly marked “Special Issue on Distributed Energy Resources, 2018” on the cover page.

The information about manuscript preparation and requirements is provided on http://tpea.cpss.org.cn/a/For_Authors/. Manuscripts submitted to this Special Issue will be reviewed and handled by the guest editorial board as noted above.

Proposed Timeline

January 15, 2020
Manuscripts submission deadline

February 15, 2020
Final acceptance notification

March 1, 2020
Camera-ready manuscripts for publication

热文推荐

15 kV SiC MOSFET: An enabling technology for medium voltage solid state transformers

Alex Q. Huang, Qianlai Zhu, Li Wang, and Liqi Zhang

FREEDM Systems Center, North Carolina State University, USA

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Design for reliability of power electronics for grid-connected photovoltaic systems

Yongheng Yang, Ariya Sangwongwanich, Frede Blaabjerg

Aalborg University, Denmark

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The past, present, and future of power electronics integration technology in motor drives

Thomas M. Jahns and Hang Dai

University of Wisconsin-Madison, USA

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Bidirectional isolated dual-active-bridge (DAB) DC-DC converters using 1.2-kV 400-A SiC-MOSFET dual modules

Hirofumi Akagi, Shin-ichi Kinouchi, and Yuji Miyazaki

Tokyo Institute of Technology, Tokyo, Japan; Mitsubishi Electric Corp., Japan

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Application of GaN devices for 1 kW server power supply with integrated magnetics

Fred C. Lee, Qiang Li, Zhengyang Liu, Yuchen Yang, Chao Fei, and Mingkai Mu

Virginia Polytechnic Institute and State University

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Data center challenges and their power electronics

Philip T. Krein

Electric Machinery and Electromechanics University of Illinois, USA

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Opening the box: Survey of high power density inverter techniques from the little box challenge

Katherine A. Kim, Yu-Chen Liu, Ming-Cheng Chen, and Huang-Jen Chiu

Ulsan National Institute of Science and Technology (UNIST), Korea; National Ilan University; National Taiwan University of Science and Technology.

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Analysis and cell-level experimental verification of a 25 kW all-SiC isolated front end 6.6 kV/400 V AC-DC solid-state transformer

Jonas E. Huber, Julian Böhler, Daniel Rothmund, and Johann W. Kolar

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Improved control strategy of interlinking converters with synchronous generator characteristic in islanded hybrid AC/DC microgrid

Gongxin Qi, Alian Chen, and Jie Chen

Shandong University, China

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Latest advances of LLC converters in high current, fast dynamic response, and wide voltage range applications

Yang Chen and Yan-Fei Liu

Queen’s University, Canada

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Perspective of loss mechanisms for silicon and wide band-gap power devices

Gerald Deboy, Oliver Haeberlen, and Michael Treu

Infineon Technologies Austria AG, Austria

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99% Efficient three-phase buck-type SiC MOSFET PFC rectifier minimizing life cycle cost in DC data centers

Lukas Schrittwieser, Johann W. Kolar, and Thiago Batista Soeiro

Power Electronic Systems Laboratory, ETH Zurich, Switzerland; ABB Switzerland Ltd., Switzerland

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Key components of modular propulsion systems for next generation electric vehicles

Alexander Stippich, Christoph H. van der Broeck, Alexander Sewergin, Arne Hendrik Wienhausen, Markus Neubert, Philipp Schülting, Silvano Taraborrelli, Hauke van Hoek, and Rik W. De Doncker

Electronics and Electrical Drives, RWTH Aachen University, Germany

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Overview of silicon carbide technology: Device, converter, system, and application

Fei Fred Wang and Zheyu Zhang

University of Tennessee, USA

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A review of SiC power module packaging: Layout, material system and integration

Cai Chen, Fang Luo, and Yong Kang

Huazhong University of Science and Technology, China; University of Arkansas, USA

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Energy challenge, power electronics & systems (PEAS) technology and grid modernization

Don Tan and Damir Novosel

Northrop Grumman Aerospace Systems (NGAS), USA; Quanta Technology and Energized Services, USA

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Electrification of subsea systems: requirements and challenges in power distribution and conversion

Kaushik Rajashekara, Harish S. Krishnamoorthy, and B. Satish Naik

University of Houston, USA

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Review of power semiconductor device reliability for power converters

Bo Wang, Jie Cai, Xiong Du, and Luowei Zhou

Chongqing University, China

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CPSS Transactions on

Power Electronics and Applications

《CPSS Transactions on Power Electronics and Applications》（缩写：CPSS TPEA）由中国电源学会主办，IEEE电力电子学会（IEEE PELS）技术协办，创刊于2016年，英文季刊，已面向国内外公开发行，收录论文均以开放获取的形式被IEEE Xplore、INSPEC收录。

《CPSS TPEA》办刊宗旨为关注电力电子与应用领域国际动向和高水平发展成果，推动国内外学术、技术交流，促进该领域新技术、新理论的研究，鼓励创新，培养和发现科技人才。

涉及的领域：开关电源，逆变器控制， SiC器件、新型功率器件及其应用，高频磁元件、集成磁技术和电磁兼容，系统仿真、建模与控制，再生能源转换技术与节能，及电力电子在输配电系统、电动车、照明和消费电子等领域中的应用。

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