By interconnecting smaller chiplets through an interposer, 2.5D integration offers a cost-effective and high-yield solution to implement large-scale modular systems. Nevertheless, the underlying network is prone to deadlock, despite deadlock-free chiplets, and to different faults on the vertical links used for connecting the chiplets to the interposer. Unfortunately, existing fault-tolerant routing techniques proposed for 2D and 3D on-chip networks cannot be applied to chiplet networks. To address these problems, this paper presents the first deadlock-free and fault-tolerant routing algorithm, called DeFT, for 2.5D integrated chiplet systems. DeFT improves the redundancy in vertical-link selection to tolerate faults in vertical links while considering network congestion. Moreover, DeFT can tolerate different vertical-link-fault scenarios while accounting for vertical-link utilization. Compared to the state-of-the-art routing algorithms in 2.5D chiplet systems, our simulation results show that DeFT improves network reachability by up to 75% with a fault rate of up to 25% and reduces the network latency by up to 40% for multi-application execution scenarios with less than 2% area overhead.
翻译:2.5D 集成通过互连器将小型小小小小芯片连接起来, 提供了实施大型模块系统的成本有效和高收益高的解决方案。 然而, 基本网络尽管没有僵局, 仍然容易陷入僵局, 并容易在用于连接芯片与互连器的垂直链接上出现不同故障。 不幸的是, 2D 和 3D 电荷网络建议的现有不容许故障路由技术无法应用于芯片网络。 为解决这些问题,本文件为2.5D 集成芯片系统提供了第一个无僵局和不易故障路径算法,称为 DeFT 。 DeFT 改进了垂直链接选择中的冗余,以容忍纵向链接中的错误,同时考虑网络拥堵。 此外, DeFT 能够容忍不同的垂直链接断层情景,同时考虑垂直链接的利用。 与 2.5D 芯片 系统中最先进的路径算法相比, 我们的模拟结果表明, DeFT 将网络的可达75%的可达标度提高到25 %, 并且将网络的固定性降低到40%, 用于多域域执行的40 % 。