基于智能软材料的柔性电子新型动态可控转印力学机理研究

项目名称： 基于智能软材料的柔性电子新型动态可控转印力学机理研究

项目编号： No.11302039

项目类型： 青年科学基金项目

立项/批准年度： 2014

项目学科： 数理科学和化学

项目作者： 李明

作者单位： 大连理工大学

项目金额： 26万元

中文摘要： 柔性电子器件可承受大变形和用于复杂工作曲面，与传统电子器件相比具有广阔的应用前景。将功能性电子元件由生长基体集成至柔性基体上的转印技术是柔性电子器件制备中的关键环节。当前转印方法侧重于改变印戳结构、利用外力和界面粘附能实现成功转印，忽视了印戳材料在外部激励下响应对转印的促进作用。受智能软材料形状记忆聚合物加热回复初始构型等独特力学行为的启发，本项目以智能软材料形状记忆聚合物为转印印戳，针对不同界面粘性基体，通过外部激励控制界面粘附作用强弱转化，实现高效率的可逆动态控制转印，并结合物理实验、理论分析和有限元模拟方法，分析印戳在外部激励下的构型变化和印戳/转体界面粘附、剥离力学问题，提出转印不同阶段界面断裂的临界条件，揭示外部激励对界面粘附作用强弱转化、转印的影响规律和机理，为设计转印系统和柔性电子器件制备提供理论指导和可行性方案。

中文关键词： 柔性电子器件；粘弹性；可控转印；断裂扩展；优化设计

英文摘要： Flexible electronics, capable of accommodating large deformation and complex curvilinear surface, have better application prospects than conventional electronics. Transfer printing approach, assembling functional devices from donor substrate to flexible receiving substrate, is the key problem in the fabrication of flexible electronics. Current transfer printing approaches emphasize on changing the stamp structure and using external force/interfacial adhesion to realize a successful transfer printing, ignoring the enhancement on transfer printing invoked by the response of stamp to external stimulus. Inspired by the unique behavior of smart soft materials, such as shape memory polymer returns to its initial configuration under heating, this project uses smart soft material shape memory polymer as stamp, controls the strong-weak transition of interfacial adhesion under external stimulus for substrates with different adhesion, and realizes the high-efficiency reversible dynamically controllable transfer printing. With experiments, theoretical analysis and finite element simulations approaches, this project analyzes the configuration change of stamp under external stimulus and the adhesion, separation of stamp/ink, proposes the critical condition of interfacial crack in different stages of transfer printing, reveals

英文关键词： flexible electronics；viscoelastic；controllable transfer printing；crack propagation；structural optimization